HIGH PERFORMANCE NEAR-INFRARED SEMICONDUCTOR

 PHOTODETECTORS and LASERS  

INDIUM SOLDER BUMPS

  We have performed flip-chip bond process in Nanotechnology Research Center. Flip Chip Bonding is most important technique to hybrid   photodetector array and read out integrated circuit.Before flip chip bonding process, each pixels of photodetector array or each contact pads of read _out   integrated pixel (ROIC) should have solder metal for hybridization.Different metals or alloys can be used for solder metal.Generally Indium, Gold,   Tin-Lead, Silver, Nickel-Iron and copper can be use for solder bump.

  Before the evaporate indium, we covered thick resist using the AZ 9260. After 12 um resist, we evaporated indium metals into Indium Evaporator   which is thermal evaporator. 8 um indium was evaporated in our system and basically completed lift-off process.

Evaporated indium after lift-off structuring

Reflow process will be done so that the evaporated indium becomes ball-shaped.For reflow process, we have used  (RTP) Rapid Thermal Processing. Melting point of indium is 156 oC. Therefore this critical temperature for reflow process should be up to melting point.  

After Reflow Process

   InP Based Low Dark Current 1.55 Micron Photodiodes

 

   LT-GaAs for 1.55 Micron Applications

 

   Fabrication and Characterization of Higher Power Laser Diodes

 

   Indium Solder Bumps

 

Metamaterials   -   Photonic Crystals   -  GaN/AlGaN Devices  -  Other Semiconductor Devices and Fabrication Techniques

© Copyright - com.web.tr. This page is best viewed with IE v.5.0 or higher, at minimum 1024x768 resolution.